At its annual Imec Technology Forum USA in San Francisco, imec, in collaboration with Soitec, a leader in the design and production of innovative semiconductor materials for the electronics industry, reported that they successfully demonstrated a sequential 3D front-end integration process by stacking two device layers on one another on a 300mm wafer.   This vertical integration of sequentially processed device layers, also named sequential-3D integration (S3D), is perceived as a promising alt...